Improved method of preventing sealing-wax from adhering to molds



UNITED STATES PATENT OFFICE...

NOAH W. KUMLER, OF DAYTON, OHIO.

IMPROVED METHOD OF PREVENTING SEALING-WAX FROM ADHERlNG T0 MOLDS.

Specification forming part of Letters Patent No. 56,576, dated July 24, 1866.

To all whom it may concern:

Be it known'that I, NOAH W. KUMLER, of the city of Dayton, county of Montgomery, and State of Ohio, have discovered a new and useful Process for Preparing Metal Molds in which Sealingax is Cast, which prevents the adhesion of the wax to the surface of the molds and enables me to remove the Wax with facility and Without injury.

This I accomplish by the application of quicksilver to the surface of the molds. To facilitate and accomplish this, I apply the quicksilver with chalk by friction or by first Washing the surface of the molds with a solution of cyanide of silver or muriate of tin.

I do not claim the discovery of anew chemical principle; but I do claim the right to use and employknown material and principles for a new and useful purpose, when such application has never been used or known before.

What I therefore claim, and desire to secure by Letters Patent, is

The application of quicksilver in the manner and for the purposes herein respectively set forth.

NOAH W. KUMLER.

Witnesses:

D. E. PRYoR, D. CUNNINGHAM. 

